|Company Name:||STMicroelectronics N.V.|
|Company Type:||Public : Milan Borsa Italiana: STM, New-York, and Paris)|
|Company Slogan:||Service & Technology|
|Foundation:||1957 as Società Generale Semiconduttori, 1987 as SGS-Thomson|
|Key People:||Carlo Bozotti, President and CEO since 2005|
Alain Dutheil, COO since 2005
Pasquale Pistorio, CEO between 1987 and 2005
|Products:||Integrated circuits for specific applications, Memories (flash, EEPROM), Microcontrollers, smartcards, analog circuits power ICs, etc.|
|Revenue:||US$ 10.0 billion (2007)|
|Num Employees:||52,180 (2008)|
While STMicroelectronics corporate headquarters and the headquarters for Europe and emerging markets, are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands.
The company’s US headquarters are in Carrollton, Texas. Headquarters for the Asia-Pacific region are based in Singapore and Japanese operations are headquartered in Tokyo. The company headquarters for the Greater China region are in Shanghai.
STMicroelectronics was formed in June 1987 by the merger of semiconductor companies SGS Microelettronica of Italy and Thomson Semiconducteurs, the semiconductor arm of France's Thomson. At the time of the merger the company was known as SGS-THOMSON but took its current name in May 1998 following the withdrawal of Thomson SA as an owner.
SGS Microelettronica and Thomson Semiconducteurs were both long-established semiconductor companies.SGS Microelettronica originated in 1972 from a previous merger of two companies:
Thomson Semiconducteurs was created in 1982 by the French government's widespread nationalisation of industries. It included:
After its creation by merger in 1987, SGS-Thomson was ranked 14th among the top 20 semiconductor suppliers with sales of around US$850 million. The company has participated in the consolidation of the semiconductor industry since its formation, with acquisitions including:
On 8 December 1994, the company completed its initial public offering on the Paris and New York stock exchanges. Owner Thomson SA sold its stake in the company in 1998 when the company also listed on the Borsa Italiana in Milan.
2002, Freescale (formerly Motorola Semiconductors) and TSMC join ST and Philips technology partnership. Alliance Crolles2 is created with a new 12" wafer manufacturing facility located in Crolles (France).
By 2005, STMicroelectronics was ranked fifth, behind Intel, Samsung, Texas Instruments and Toshiba, but ahead of Infineon, Renesas, NEC, NXP, and Freescale. The company is the largest European semiconductors supplier, ahead of Infineon and NXP (see Semiconductor sales leaders by year).
End of 2007, NXP (formerly Philips Semiconductors) and Freescale decide to stop their participation in Crolles2 Alliance.
May 22nd, 2007; ST and Intel create a joint venture in the memory application called Numonyx. This new company merge ST and Intel Flash Memory activities.
Continuing to the semiconductor market consolidation, the April 1Oth 2008, ST and NXP announce the creation of a new joint venture of their mobile activities. ST will own 80% of the new company and NXP 20%. This joint venture has effectively been started in August 20th 2008.
On February 10, 2009 ST Ericsson, a joint venture bringing together ST-NXP Wireless and Ericsson Mobile Platforms, was established.
As of 2005 the shareholders were:
ST consists of five product groups. Each group is composed of several divisions or business units. Each division is responsible for the design, industrialization, manufacturing and marketing for its own product portfolio. Operations are assisted by a central R&D organisation and the local sales offices.
STMicroelectronics has been involved in developing MEMS since 2001. This research and development was initially done at the company's Castelletto site but since its closure in June 2006, MEMS activities have moved to the Agrate main fab.
Following an earlier failure, STMicroelectronics has stayed out of the volatile markets for DRAM and PC microprocessors. In 1994, it attempted to launch compatible Intel 80486 microprocessors in partnership with American company Cyrix. One model only was completed, the 1995 Cyrix M1 microprocessor, which was intended to compete with Intel's Pentium family.
Unlike so-called fabless semiconductor companies, STMicroelectronics owns and operates its own semiconductor wafer fabs. The company owned five 8 inch (200 mm) wafer fabs and one 12 inch (300 mm) wafer fab in 2006. Most of the production is scaled at 0.18 µm, 0.13 µm, 90 nm and 65 nm (measurements of gate transistor length). STMicroelectronics also owns back-end plants, where silicon dies are assembled and bonded into plastic or ceramic packages.
Major sites include:
Employing 6,000 staff, the Milan facilities match Grenoble in importance. Agrate Brianza, employs around 4000 staff and is a historical base of the company (ex SGS). The site has several fab lines (including an 8 inch (200 mm) fab) and an R&D center. Castelletto, employs 300 to 400 staff and hosts some divisions and R&D centers.
The Catania plant in Sicily employs 5,000 staff and hosts several R&D centers and divisions, focusing on flash memory technologies as well as two fabs. The plant was launched in 1961 by ATES to supply under licensing to RCA of the US and initially using Germanium. The site's two major wafer fabs are * an 8 inch (200 mm) fab, opened in April 1997 by Romano Prodi, president of the Italian council and a 12 inch (300 mm) fab under construction.
Grenoble is one of the company's most important R&D centres, employing around 6,000 staff. The Polygone site employs 2200 staff and is one of the historical bases of the company (ex SGS). All the historical wafer fab lines are now closed but the site hosts the headquarters of many divisions (marketing, design, industrialization) and an important R&D center, focused on silicon and software design and fab process development.
The Crolles site hosts an 8 inch (200 mm) and a 12 inch (300 mm) fab and was originally built as a common R&D center for submicrometre technologies as part of the 1990 Grenoble 92 partnership between SGS-Thomson and CNET, the R&D center of French telecom company France Telecom. The 8 inch (200 mm) fab, known as Crolles 1, is the company's first and was built as part of a 1991 partnership between SGS-Thomson and Philips to develop new manufacturing technologies. Crolles 1 was opened on 9 September 1993 by Gérard Longuet, French minister for industry.
The 12 inch (300 mm) fab was inaugurated by French president Jacques Chirac, on 27 February 2003. It includes a R&D center which focuses on developing new nanometric technology processes for 90 nm to 32 nm scale using 12 inch (300 mm) wafers is the result of the The Crolles 2 Alliance. STMicroelectronics, TSMC, NXP Semiconductors (formerly Philips semiconductor) and Freescale (formerly Motorola semiconductor) partnered in 2002 to develop the facility. The technologies developed at the facility are being used by global semiconductor foundry TSMC of Taiwan, to launch production facilities in Taiwan.
Employing around 3,000 staff, Rousset hosts several division headquarters including smartcards, microcontrollers, serial flash and EEPROM as well as several R&D centers. Rousset also hosts an 8 inch (200 mm) fab which was opened on 15 May 2000 by French prime minister Lionel Jospin.
The site opened in 1979 as a 4 inch (100 mm) fab opertated by Eurotechnique, a joint venture between Saint Gobain of France and National Semiconductor of the US. Rousset was sold to Thomson-CSF in 1982 as part of the French government's 1981-82 nationalization of several industries. As part of the nationalisation, a former Thomson plant in the center of Aix-en-Provence operating since the 1960s was closed and staff were transferred to the new Rousset site. The original 4 inch (100 mm) fab was upgraded into 5 inch (130 mm) and later 6 inch (150 mm) fab in 1996. It is now being shut down.
In 1988, a small group of employees from the Thomson Rousset plant (including the director, Marc Lassus) founded a start-up company, Gemalto (formerly known as Gemplus) which became a leader in the smartcard industry.
Employing 1500 staff, this site hosts a fab and R&D centers.
In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh. Then in 1981, SGS decided to build a waferfab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its firstwafers in 1984. Converted up to 8 inch (200 mm) fab, this is now an important 8 inch (200 mm) wafer fab of the group. Ang Mo Kio also hosts some design centers. The site currently employs 6000 staff.
Application, design and support.
The Carrollton site was built in 1969 by Mostek, an American company founded by former employees of Texas Instruments. Mostek was acquired by United Technologies which was in turn purchased by Thomson Semiconducteurs in 1985. Initially equipped with a 4 inch (100 mm) fab, it was converted into a 6 inch (150 mm) fab in 1988. The Colorado Springs activities of British company INMOS were transferred to Carrolton in 1989 following its acquisition SGS Thomson. Since then the site has been refocused to wafer testing. On July 10, 2007, ST announced it would close this fab.
SGS first presence in the US was a sales office based in Phoenix in the early 1980s. Later, under SGS-Thomson, an 8 inch (200 mm) fab was completed in Phoenix in 1995. The company's second 8" fab after Crolles 1, the site was first dedicated to producing microprocessors for Cyrix. The 8 inch (200 mm) fab is now used to manufacture machines for the company. On July 10, 2007, ST said that it would close this fab.